We are part of a world-class product development organization that pioneers industry leading hardware designs for IBM POWER Systems servers as well as Storage, Quantum, and IBM Research. Within this organization, the India System design team is seeking a professional with experience in package design having skills in system design, package technology, board routing, and PCB development to join industry leading engineers in pioneering the future of high performance and high reliability packaging and server solutions.
This position involves end to end ownership of the server logical/physical planning development. The right candidate will have the opportunity to drive industry leading technology and work with a team of world class experts in the field of system, package, and PCB technology. Responsibilities for this role span from inception/concept creation, to implementation, and field support throughout the products' lifecycle.
This Package Team is currently looking to fill a position that requires strong fundamentals in System-in-Package (SiP) design, signal and power integrity, and package technology, pc board layout with a high level of analysis and design skills. Ideal candidate will show independence and the ability to be a self-starter.
Responsibilities
Work with stakeholders and others in a multidisciplinary team to define requirements and develop the system solution for next generation enterprise server systems.
Responsible for defining new component pinout definition, system logic, logic to card partitioning, card area analysis for required component fit, and route ability for the design.
Must ensure design is released on schedule to meet project milestones.
Included in this role is development of new components, pinouts, and routing plans that are compatible within multiple system designs.
As a core member of the team, you will be expected to work autonomously and deliver designs on time and on budget.
We encourage you to continuously develop your skills to meet dynamic changes in the industry