Semiconductor Package Design – Electrical Analysis Engineer

We are part of a world-class product development organization that pioneers industry leading hardware designs for IBM POWER Systems servers as well as Storage, Quantum, and IBM Research. Within this organization, The India System design team is seeking a professional with experience in Package Design Electrical Analysis Engineer role. We develop laminate and interconnect products to enable semiconductor packaging for the IBM Product Set
This position involves you to work in the development of IBM semiconductor substrate and interconnect solutions used in the server hardware applications
Responsibilities
The IBM Semiconductor Enablement Team is a highly collaborative group, and its key mission is to support IBM system hardware development including Si substrate and interconnect solutions. This group works closely with packaging development and manufacturing teams, procurement team and directly with our core suppliers to support the group's overall mission.Responsible for the next generation laminate and high speed interconnect technology development and qualification, driving supplier quality and technology improvements.
Support laminate design team in the verification of product electrical design to ensure electrical signal integrity and manufacturability.
Responsible for the measurement and modeling of laminate product electrical performance including signal attenuation, reflection, transmission, impedance, cross talk, current carrying capability etc.
Strategically align with packaging development team in the efforts to understand laminate product failures through root cause analysis.